{"success":true,"data":{"pressRelease":{"id":"147956","rtpr_id":"nBw2xQxMta-20260921","ticker":"MRVL","exchange":"NASDAQ","all_tickers":["MRVL"],"title":"Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026","author":"Business Wire","published_at":"2026-09-21T05:00:00.173Z","article_body":"Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data\nCenter Infrastructure at ECOC 2026\n\n\n * First 2nm demos: Demonstrations of first 2nm 400G/lane optical PAM4, first 2nm\n800G ZR/ZR+ pluggable with MACsec and first 2nm 1.6T ZR and O-band\ncoherent-lite technologies.\n\n * Enabling AI infrastructure scaling: Marvell advanced optical and silicon\ndesign leverages leading-edge process nodes to deliver the improvements in\nperformance, bandwidth density and power critical to scaling AI infrastructure\nefficiently.\n\n * Innovation on display at ECOC: Marvell to showcase the breadth of its\ncomprehensive AI infrastructure portfolio through 38 advanced technology\ndemos. These include the Marvell 102.4T co-packaged optics (CPO) platform,\nalongside additional demos developed with its partner ecosystem.\n\n \n\nMarvell Technology, Inc.\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2F&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=Marvell+Technology%2C+Inc.&index=1&md5=b72f96872c7b1fd93424b1d9b75b2579)\n(NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today\nannounced industry-first 2nm optical interconnect demonstrations that advance\nthe next generation of AI data center connectivity. The technologies will be\nshowcased at the European Conference on Optical Communication (ECOC) 2026,\nSeptember 20–24, 2026, in Málaga, Spain, underscoring how Marvell\ncontinually delivers new waves of advanced connectivity solutions to scale AI\ninfrastructure.\n\nAs AI data center architectures scale from 1.6T to 3.2T and beyond, operators\nrequire faster, lower-power and more secure optical interconnects to serve AI\nscale-up, scale-out and scale-across domains. Increasing bandwidth density\nwhile reducing power per bit has become critical to scaling AI infrastructure\nefficiently.\n\nBuilding upon a multi-generational history of industry firsts—including the\nfirst 5nm 200G/lane 1.6T Marvell® Nova DSPs in 2023, the 3nm 1.6T Ara\nplatform in 2024 and the 2nm 800G Libra DSPs announced earlier this\nyear—today Marvell is extending its portfolio of industry-leading 2nm\nconnectivity solutions, including optical PAM4, coherent-lite PAM4/IMDD and\nZR/ZR+ coherent solutions in the 2nm node. These technologies are optimized to\nenable ultra-high-speed interconnects that deliver faster communication\nbetween XPUs, CPUs, accelerators, and memory resources and improve energy\nefficiency to help data center operators manage the ever-increasing power\ndemands of large AI deployments.\n\nAt ECOC 2026 Marvell will highlight:\n\n\n * First 2nm 400G/lane optical PAM4 demonstration: Highlighting the company’s\nmulti-generational PAM4 leadership, the technology provides low-power,\nultra-high-speed optical connections to help scale AI infrastructure, enabling\nthe transition to 3.2T data center connectivity.\n\n * First live demonstration of 2nm 800G ZR/ZR+ with MACsec: Powered by the \nMarvell Libra 2nm coherent DSP\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fnewsroom%2Fmarvell-1-6t-zr-zr-plus-pluggable-2nm-coherent-dsp-ai-interconnects.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=Marvell+Libra+2nm+coherent+DSP&index=2&md5=6e49ecaa6a9218b866f69156ffe640c8)\n\n, the 800G ZR/ZR+ OSFP pluggable integrates media access control security\n(MACsec), expanding the company’s extensive coherent DSP and Marvell\nCOLORZ® pluggable portfolios, delivering efficient, high-performance and\nsecure optical transmission for hyperscale AI and cloud data center networks\nworldwide.\n\n * First 2nm 1.6T ZR and coherent-lite O-band demonstrations: The 1.6T ZR and\n1.6T coherent-lite demonstrations are powered by next-generation Marvell DSPs \nannounced earlier this year\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fnewsroom%2Fmarvell-1-6t-zr-zr-plus-pluggable-2nm-coherent-dsp-ai-interconnects.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=announced+earlier+this+year&index=3&md5=b02423d99f000e434f4786ebc1775fa4)\n\n, optimized to deliver high-bandwidth connectivity within and between data\ncenter facilities and paving the way for 3.2T connectivity.\n\n * Advanced CPO technology for next-generation AI fabrics: The Marvell CPO\nplatform integrates optics directly with AI accelerators and switch silicon,\nas per-lane speeds and multi-rack AI pods push past copper’s reach limits.\nDemonstrated at 102.4 Tbps with 200G-per-lane silicon photonics, the platform\ndelivers the bandwidth density and power efficiency needed to scale AI\nfabrics.\n\n“AI data center operators need optical interconnect technologies that\ndeliver higher bandwidth, lower power and greater security across every part\nof the network,” said Xi Wang, senior vice president and general manager,\nConnectivity Business Unit at Marvell. “These ECOC demonstrations highlight\nhow Marvell continually pushes the envelope of what is possible in optical\ntechnology to help hyperscaler and cloud data center customers achieve new\nlevels of performance, efficiency and scalability to drive new waves of\ninnovation.”\n\nMarvell Executive Presentations and Booth Demos at ECOC 2026\n\nMarvell executives will also participate in presentations and panels on\noptical connectivity for next-generation AI data center infrastructure. This\nincludes a fireside chat on new and emerging optical technologies with Senior\nVice President and General Manager of the Connectivity Business Group Xi Wang,\nand sessions by several other Marvell experts. A full lineup of Marvell\nspeaking sessions is available here\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fevents%2Fecoc-2026.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=here&index=4&md5=304b4b6a7d133eaa57be7ac233dfc87d)\n.\n\nIn addition to industry-first 2nm demonstrations, Marvell will also showcase\nsolutions across its AI infrastructure portfolio at ECOC (Booth # 2002)\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fevents%2Fecoc-2026.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=ECOC+%28Booth+%23+2002%29&index=5&md5=87182bb09ac6b9238e40b3454e737328)\n, from 224G SerDes and 1.6T optics to coherent interconnects and optical\nmemory fabrics.\n\nTo learn more or experience the technology demonstrations at ECOC 2026,\ncontact your Marvell sales representative.\n\nAbout Marvell\n\nTo deliver the data infrastructure technology that connects the world, we’re\nbuilding solutions on the most powerful foundation: our partnerships with our\ncustomers. Trusted by the world’s leading technology companies for over 30\nyears, we move, store, process and secure the world’s data with\nsemiconductor solutions designed for our customers’ current needs and future\nambitions. Through a process of deep collaboration and transparency, we’re\nultimately changing the way tomorrow’s enterprise, cloud and carrier\narchitectures transform—for the better.\n\nMarvell and the M logo are trademarks of Marvell or its affiliates. Please\nvisit www.marvell.com\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2F&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=www.marvell.com&index=6&md5=72f20c8960e6370c6e4cc38eea144504)\nfor a complete list of Marvell trademarks. Other names and brands may be\nclaimed as the property of others.\n\nThis press release contains forward-looking statements within the meaning of\nthe federal securities laws that involve risks and uncertainties.\nForward-looking statements include, without limitation, any statement that may\npredict, forecast, indicate or imply future events, results or achievements.\nActual events, results or achievements may differ materially from those\ncontemplated in this press release. Forward-looking statements are only\npredictions and are subject to risks, uncertainties and assumptions that are\ndifficult to predict, including those described in the “Risk Factors”\nsection of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and\nother documents filed by us from time to time with the SEC. Forward-looking\nstatements speak only as of the date they are made. Readers are cautioned not\nto put undue reliance on forward-looking statements, and no person assumes any\nobligation to update or revise any such forward-looking statements, whether as\na result of new information, future events or otherwise.\n\n\n\nView source version on businesswire.com:\nhttps://www.businesswire.com/news/home/20260920935708/en/\n(https://www.businesswire.com/news/home/20260920935708/en/)\n\nMedia Contact:\n\nGeorge Millington\n\npr@marvell.com (mailto:pr@marvell.com)\n\n\nCopyright Business Wire 2026","article_body_html":"","raw_payload":{"data":{"id":"nBw2xQxMta-20260921","title":"Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026","author":"Business Wire","ticker":"MRVL","created":"2026-09-21T05:00:00.173Z","tickers":["MRVL"],"exchange":"NASDAQ","article_body":"Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data\nCenter Infrastructure at ECOC 2026\n\n\n * First 2nm demos: Demonstrations of first 2nm 400G/lane optical PAM4, first 2nm\n800G ZR/ZR+ pluggable with MACsec and first 2nm 1.6T ZR and O-band\ncoherent-lite technologies.\n\n * Enabling AI infrastructure scaling: Marvell advanced optical and silicon\ndesign leverages leading-edge process nodes to deliver the improvements in\nperformance, bandwidth density and power critical to scaling AI infrastructure\nefficiently.\n\n * Innovation on display at ECOC: Marvell to showcase the breadth of its\ncomprehensive AI infrastructure portfolio through 38 advanced technology\ndemos. These include the Marvell 102.4T co-packaged optics (CPO) platform,\nalongside additional demos developed with its partner ecosystem.\n\n \n\nMarvell Technology, Inc.\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2F&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=Marvell+Technology%2C+Inc.&index=1&md5=b72f96872c7b1fd93424b1d9b75b2579)\n(NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today\nannounced industry-first 2nm optical interconnect demonstrations that advance\nthe next generation of AI data center connectivity. The technologies will be\nshowcased at the European Conference on Optical Communication (ECOC) 2026,\nSeptember 20–24, 2026, in Málaga, Spain, underscoring how Marvell\ncontinually delivers new waves of advanced connectivity solutions to scale AI\ninfrastructure.\n\nAs AI data center architectures scale from 1.6T to 3.2T and beyond, operators\nrequire faster, lower-power and more secure optical interconnects to serve AI\nscale-up, scale-out and scale-across domains. Increasing bandwidth density\nwhile reducing power per bit has become critical to scaling AI infrastructure\nefficiently.\n\nBuilding upon a multi-generational history of industry firsts—including the\nfirst 5nm 200G/lane 1.6T Marvell® Nova DSPs in 2023, the 3nm 1.6T Ara\nplatform in 2024 and the 2nm 800G Libra DSPs announced earlier this\nyear—today Marvell is extending its portfolio of industry-leading 2nm\nconnectivity solutions, including optical PAM4, coherent-lite PAM4/IMDD and\nZR/ZR+ coherent solutions in the 2nm node. These technologies are optimized to\nenable ultra-high-speed interconnects that deliver faster communication\nbetween XPUs, CPUs, accelerators, and memory resources and improve energy\nefficiency to help data center operators manage the ever-increasing power\ndemands of large AI deployments.\n\nAt ECOC 2026 Marvell will highlight:\n\n\n * First 2nm 400G/lane optical PAM4 demonstration: Highlighting the company’s\nmulti-generational PAM4 leadership, the technology provides low-power,\nultra-high-speed optical connections to help scale AI infrastructure, enabling\nthe transition to 3.2T data center connectivity.\n\n * First live demonstration of 2nm 800G ZR/ZR+ with MACsec: Powered by the \nMarvell Libra 2nm coherent DSP\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fnewsroom%2Fmarvell-1-6t-zr-zr-plus-pluggable-2nm-coherent-dsp-ai-interconnects.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=Marvell+Libra+2nm+coherent+DSP&index=2&md5=6e49ecaa6a9218b866f69156ffe640c8)\n\n, the 800G ZR/ZR+ OSFP pluggable integrates media access control security\n(MACsec), expanding the company’s extensive coherent DSP and Marvell\nCOLORZ® pluggable portfolios, delivering efficient, high-performance and\nsecure optical transmission for hyperscale AI and cloud data center networks\nworldwide.\n\n * First 2nm 1.6T ZR and coherent-lite O-band demonstrations: The 1.6T ZR and\n1.6T coherent-lite demonstrations are powered by next-generation Marvell DSPs \nannounced earlier this year\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fnewsroom%2Fmarvell-1-6t-zr-zr-plus-pluggable-2nm-coherent-dsp-ai-interconnects.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=announced+earlier+this+year&index=3&md5=b02423d99f000e434f4786ebc1775fa4)\n\n, optimized to deliver high-bandwidth connectivity within and between data\ncenter facilities and paving the way for 3.2T connectivity.\n\n * Advanced CPO technology for next-generation AI fabrics: The Marvell CPO\nplatform integrates optics directly with AI accelerators and switch silicon,\nas per-lane speeds and multi-rack AI pods push past copper’s reach limits.\nDemonstrated at 102.4 Tbps with 200G-per-lane silicon photonics, the platform\ndelivers the bandwidth density and power efficiency needed to scale AI\nfabrics.\n\n“AI data center operators need optical interconnect technologies that\ndeliver higher bandwidth, lower power and greater security across every part\nof the network,” said Xi Wang, senior vice president and general manager,\nConnectivity Business Unit at Marvell. “These ECOC demonstrations highlight\nhow Marvell continually pushes the envelope of what is possible in optical\ntechnology to help hyperscaler and cloud data center customers achieve new\nlevels of performance, efficiency and scalability to drive new waves of\ninnovation.”\n\nMarvell Executive Presentations and Booth Demos at ECOC 2026\n\nMarvell executives will also participate in presentations and panels on\noptical connectivity for next-generation AI data center infrastructure. This\nincludes a fireside chat on new and emerging optical technologies with Senior\nVice President and General Manager of the Connectivity Business Group Xi Wang,\nand sessions by several other Marvell experts. A full lineup of Marvell\nspeaking sessions is available here\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fevents%2Fecoc-2026.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=here&index=4&md5=304b4b6a7d133eaa57be7ac233dfc87d)\n.\n\nIn addition to industry-first 2nm demonstrations, Marvell will also showcase\nsolutions across its AI infrastructure portfolio at ECOC (Booth # 2002)\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2Fcompany%2Fevents%2Fecoc-2026.html&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=ECOC+%28Booth+%23+2002%29&index=5&md5=87182bb09ac6b9238e40b3454e737328)\n, from 224G SerDes and 1.6T optics to coherent interconnects and optical\nmemory fabrics.\n\nTo learn more or experience the technology demonstrations at ECOC 2026,\ncontact your Marvell sales representative.\n\nAbout Marvell\n\nTo deliver the data infrastructure technology that connects the world, we’re\nbuilding solutions on the most powerful foundation: our partnerships with our\ncustomers. Trusted by the world’s leading technology companies for over 30\nyears, we move, store, process and secure the world’s data with\nsemiconductor solutions designed for our customers’ current needs and future\nambitions. Through a process of deep collaboration and transparency, we’re\nultimately changing the way tomorrow’s enterprise, cloud and carrier\narchitectures transform—for the better.\n\nMarvell and the M logo are trademarks of Marvell or its affiliates. Please\nvisit www.marvell.com\n(https://cts.businesswire.com/ct/CT?id=smartlink&url=https%3A%2F%2Fwww.marvell.com%2F&esheet=54607203&newsitemid=20260920935708&lan=en-US&anchor=www.marvell.com&index=6&md5=72f20c8960e6370c6e4cc38eea144504)\nfor a complete list of Marvell trademarks. Other names and brands may be\nclaimed as the property of others.\n\nThis press release contains forward-looking statements within the meaning of\nthe federal securities laws that involve risks and uncertainties.\nForward-looking statements include, without limitation, any statement that may\npredict, forecast, indicate or imply future events, results or achievements.\nActual events, results or achievements may differ materially from those\ncontemplated in this press release. Forward-looking statements are only\npredictions and are subject to risks, uncertainties and assumptions that are\ndifficult to predict, including those described in the “Risk Factors”\nsection of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and\nother documents filed by us from time to time with the SEC. Forward-looking\nstatements speak only as of the date they are made. Readers are cautioned not\nto put undue reliance on forward-looking statements, and no person assumes any\nobligation to update or revise any such forward-looking statements, whether as\na result of new information, future events or otherwise.\n\n\n\nView source version on businesswire.com:\nhttps://www.businesswire.com/news/home/20260920935708/en/\n(https://www.businesswire.com/news/home/20260920935708/en/)\n\nMedia Contact:\n\nGeorge Millington\n\npr@marvell.com (mailto:pr@marvell.com)\n\n\nCopyright Business Wire 2026"},"type":"article","timestamp":"2026-09-21T05:00:00.219192102Z","server_sent_at_ms":1789966800219},"received_at":"2026-09-21T05:00:00.325Z","source_url":"https://www.businesswire.com/news/home/20260920935708/en/"},"analysis":{"id":"136757","press_release_id":"147956","analysis_json":{"industry":{"label":"Semiconductors & Semiconductor Equipment","sector":"Information Technology"},"redFlags":["Pre-production technology demonstrations; no revenue, customer names, or volume commitments disclosed"],"eventType":"product_launch","narrative":"Marvell announced industry-first 2nm optical interconnect demonstrations for AI data centers, to be showcased at ECOC 2026 in Málaga, Spain, September 20–24, 2026.\n\nThe demonstrations include the first 2nm 400G/lane optical PAM4, a first live 2nm 800G ZR/ZR+ pluggable with MACsec powered by the Libra coherent DSP, and first 2nm 1.6T ZR and coherent-lite O-band technologies aimed at enabling the transition to 3.2T connectivity.\n\nMarvell will also display its 102.4 Tbps co-packaged optics platform with 200G-per-lane silicon photonics among 38 total technology demos, with executives including Xi Wang participating in conference panels.\n\nThe showcase reinforces Marvell's optical DSP roadmap for hyperscale AI networks, though the release discloses no revenue, named customers, or volume commitments.","sentiment":"bullish","agentHooks":{"shouldPost":false,"suggestedAngle":"Industry-first 2nm optical demos reinforce Marvell's AI interconnect roadmap into the 3.2T era -- watch for hyperscaler design-win follow-through."},"keyFigures":{"customDimensions":{"cpo_lane_speed":"200G-per-lane silicon photonics","technology_demos":38,"demonstrated_firsts":["2nm 400G/lane optical PAM4","2nm 800G ZR/ZR+ with MACsec","2nm 1.6T ZR","2nm 1.6T coherent-lite O-band"],"cpo_platform_bandwidth_tbps":102.4}},"quotedText":"AI data center operators need optical interconnect technologies that\ndeliver higher bandwidth, lower power and greater security across every part\nof the network","namedEntities":{"people":[{"name":"Xi Wang","role":"Senior Vice President and General Manager, Connectivity Business Unit at Marvell"}],"products":["Marvell Libra 2nm coherent DSP","Marvell Nova DSPs","Ara platform","Marvell COLORZ pluggables","102.4T co-packaged optics (CPO) platform","2nm 800G ZR/ZR+ OSFP pluggable","224G SerDes"],"companies":[{"name":"Marvell Technology, Inc.","ticker":"MRVL","relationship":"filer"}],"dollarAmounts":[]},"materialImpact":{"score":2,"reasoning":"Trade-show technology showcase with no financial figures, customer commitments, or guidance. The industry-first 2nm demos strengthen Marvell's AI optical interconnect positioning, but these are pre-production demonstrations rather than booked revenue events."},"tickerRelevance":{"others":[],"primary":"MRVL"},"globalImportance":25,"audienceRelevance":55,"eventTypeSecondary":[],"importanceComponents":{"tickerTier":"large-cap","eventGravity":"trade-show technology showcase","sectorWeight":"semiconductors / AI data center infrastructure","householdBrandBoost":"moderate","retailFavoriteBoost":"AI-infrastructure retail favorite","financialMateriality":"none stated"}},"event_type":"product_launch","event_type_secondary":null,"sentiment":"bullish","material_impact_score":2,"narrative":"Marvell announced industry-first 2nm optical interconnect demonstrations for AI data centers, to be showcased at ECOC 2026 in Málaga, Spain, September 20–24, 2026.\n\nThe demonstrations include the first 2nm 400G/lane optical PAM4, a first live 2nm 800G ZR/ZR+ pluggable with MACsec powered by the Libra coherent DSP, and first 2nm 1.6T ZR and coherent-lite O-band technologies aimed at enabling the transition to 3.2T connectivity.\n\nMarvell will also display its 102.4 Tbps co-packaged optics platform with 200G-per-lane silicon photonics among 38 total technology demos, with executives including Xi Wang participating in conference panels.\n\nThe showcase reinforces Marvell's optical DSP roadmap for hyperscale AI networks, though the release discloses no revenue, named customers, or volume commitments.","key_figures":{"customDimensions":{"cpo_lane_speed":"200G-per-lane silicon photonics","technology_demos":38,"demonstrated_firsts":["2nm 400G/lane optical PAM4","2nm 800G ZR/ZR+ with MACsec","2nm 1.6T ZR","2nm 1.6T coherent-lite O-band"],"cpo_platform_bandwidth_tbps":102.4}},"named_entities":{"people":[{"name":"Xi Wang","role":"Senior Vice President and General Manager, Connectivity Business Unit at Marvell"}],"products":["Marvell Libra 2nm coherent DSP","Marvell Nova DSPs","Ara platform","Marvell COLORZ pluggables","102.4T co-packaged optics (CPO) platform","2nm 800G ZR/ZR+ OSFP pluggable","224G SerDes"],"companies":[{"name":"Marvell Technology, Inc.","ticker":"MRVL","relationship":"filer"}],"dollarAmounts":[]},"model_name":"glm-5.3-flash","prompt_hash":"sha256:727b4b9429a443af","schema_hash":"sha256:05005c02d9cffac9","created_at":"2026-09-21T05:01:39.457Z","global_importance":25,"audience_relevance":55,"importance_components":{"tickerTier":"large-cap","eventGravity":"trade-show technology showcase","sectorWeight":"semiconductors / AI data center infrastructure","householdBrandBoost":"moderate","retailFavoriteBoost":"AI-infrastructure retail favorite","financialMateriality":"none stated"}},"durationMs":99111,"modelName":"glm-5.3-flash"}}