{"success":true,"data":{"pressRelease":{"id":"155783","rtpr_id":"nPrecwGFNa-20260929","ticker":"2324","exchange":"TWSE","all_tickers":["2324"],"title":"Compal Brings NVIDIA AI Factory Infrastructure to OCP Global Summit 2026","author":"PR Newswire","published_at":"2026-09-29T16:00:01.692Z","article_body":"Compal Brings NVIDIA AI Factory Infrastructure to OCP Global Summit 2026\nPR Newswire\n\nSAN JOSE, Calif., Sept. 29, 2026\n\nFrom megawatt-scale power to advanced cooling and accelerated computing,\nCompal demonstrates the infrastructure foundation for the next generation of\nAI factories.\n\nSAN JOSE, Calif., Sept. 29, 2026 /PRNewswire/ -- Compal Electronics, Inc.\n(Compal; TWSE: 2324), a global leader in computing and infrastructure\nsolutions, today announced that it will showcase its next-generation AI\nfactory infrastructure at OCP Global Summit 2026, demonstrating how power,\ncooling, compute and rack-scale engineering must evolve together to support\nthe rapidly increasing demands of NVIDIA accelerated computing.\n\n\n\nAs AI factories move toward unprecedented compute density and megawatt-scale\npower requirements, the challenge is no longer simply adding more GPUs. The\ninfrastructure surrounding accelerated computing—from power delivery and\nthermal management to rack integration—must be redesigned to support the\nperformance, efficiency and scalability required by next-generation AI\nworkloads.\n\nAt OCP, Compal will demonstrate how it is engineering this infrastructure\naround NVIDIA accelerated computing, bringing together high-density compute\nplatforms with next-generation power and cooling technologies to create a more\nintegrated foundation for scalable AI factories.\n\nRethinking Power for the AI Factory\n\nPower architecture is becoming one of the defining challenges of large-scale\nAI infrastructure. To address rapidly increasing rack power density, Compal is\nadvancing 800VDC power architecture and megawatt-class power infrastructure\ndesigned for the requirements of next-generation AI data centers.\n\nBy moving toward higher-voltage DC architectures and more efficient power\ndelivery, Compal aims to reduce power conversion complexity and support\nincreasingly dense AI environments. This approach establishes a scalable power\nfoundation capable of evolving alongside future generations of accelerated\ncomputing.\n\nCooling Infrastructure Built for Higher Density\n\nGreater compute density also requires a fundamental shift in thermal\nmanagement. Compal is expanding its infrastructure portfolio with advanced\nliquid-cooling technologies and megawatt-scale cooling capabilities, enabling\nAI systems to operate efficiently as rack densities continue to rise.\n\nRather than treating compute, power and cooling as separate systems, Compal is\nengineering them as interconnected elements of the AI factory. By considering\nthese technologies together at the rack and data-center level, Compal can\noptimize infrastructure around the requirements of high-performance\naccelerated computing.\n\nEngineering from the Grid to the GPU\n\nTogether, these capabilities represent Compal's evolution beyond individual\nserver platforms toward a broader AI infrastructure strategy. By combining\naccelerated computing, power, cooling and rack-scale integration with global\nengineering and manufacturing resources, Compal is helping customers bridge\nthe gap between advanced AI technology and real-world, large-scale deployment.\n\n\"Building the next generation of AI factories requires us to rethink the\nentire infrastructure surrounding accelerated computing,\" said Alan Chang,\nVice President of ISBG at Compal. \"Compal is bringing together power, cooling,\nrack integration and NVIDIA accelerated computing to help customers build AI\ninfrastructure that can scale efficiently from the platform level to\nmegawatt-scale deployments.\"\n\nAt OCP, Compal will demonstrate how these infrastructure technologies come\ntogether to address the growing power, thermal and deployment challenges of\nthe AI era—engineering the critical infrastructure from the grid to the GPU.\n\nVisit Compal at OCP Global Summit 2026, Booth #E65, to discover the\ninfrastructure behind the next generation of NVIDIA-powered AI factories.\n\nAbout Compal\n\nEstablished in 1984, Compal has grown into a leading global manufacturer of\ncomputers and smart devices, partnering with top-tier brands worldwide. Compal\nwas recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers\nand has consistently ranked among the Forbes Global 2000 companies. Compal has\nactively expanded into new growth areas, including cloud servers, automotive\nelectronics, smart medical and healthcare, and advanced communication\nsolutions. Headquartered in Taipei, Taiwan, Compal operates design and\nproduction facilities in the United States, Taiwan, China, Vietnam, Mexico,\nBrazil, and Poland. Learn more at https://www.compal.com\n\n\n\nView original content to download\nmultimedia:https://www.prnewswire.co.uk/news-releases/compal-brings-nvidia-ai-factory-infrastructure-to-ocp-global-summit-2026-302892755.html\n\n\n\nMedia Inquiries: Jack Wang, Vice president and Spokesperson, +886-2-8797-8588, Investor@compal.com\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS1998292/20260929044617EDT_image_1.jpg?id=OA2976353\nhttps://mmx.prnewswire.com/media/MS1852570/COMPAL-ELECTRONICS-Logo.jpg?id=OA2976354\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved.","article_body_html":"","raw_payload":{"data":{"id":"nPrecwGFNa-20260929","title":"Compal Brings NVIDIA AI Factory Infrastructure to OCP Global Summit 2026","author":"PR Newswire","ticker":"2324","created":"2026-09-29T16:00:01.692Z","tickers":["2324"],"exchange":"TWSE","article_body":"Compal Brings NVIDIA AI Factory Infrastructure to OCP Global Summit 2026\nPR Newswire\n\nSAN JOSE, Calif., Sept. 29, 2026\n\nFrom megawatt-scale power to advanced cooling and accelerated computing,\nCompal demonstrates the infrastructure foundation for the next generation of\nAI factories.\n\nSAN JOSE, Calif., Sept. 29, 2026 /PRNewswire/ -- Compal Electronics, Inc.\n(Compal; TWSE: 2324), a global leader in computing and infrastructure\nsolutions, today announced that it will showcase its next-generation AI\nfactory infrastructure at OCP Global Summit 2026, demonstrating how power,\ncooling, compute and rack-scale engineering must evolve together to support\nthe rapidly increasing demands of NVIDIA accelerated computing.\n\n\n\nAs AI factories move toward unprecedented compute density and megawatt-scale\npower requirements, the challenge is no longer simply adding more GPUs. The\ninfrastructure surrounding accelerated computing—from power delivery and\nthermal management to rack integration—must be redesigned to support the\nperformance, efficiency and scalability required by next-generation AI\nworkloads.\n\nAt OCP, Compal will demonstrate how it is engineering this infrastructure\naround NVIDIA accelerated computing, bringing together high-density compute\nplatforms with next-generation power and cooling technologies to create a more\nintegrated foundation for scalable AI factories.\n\nRethinking Power for the AI Factory\n\nPower architecture is becoming one of the defining challenges of large-scale\nAI infrastructure. To address rapidly increasing rack power density, Compal is\nadvancing 800VDC power architecture and megawatt-class power infrastructure\ndesigned for the requirements of next-generation AI data centers.\n\nBy moving toward higher-voltage DC architectures and more efficient power\ndelivery, Compal aims to reduce power conversion complexity and support\nincreasingly dense AI environments. This approach establishes a scalable power\nfoundation capable of evolving alongside future generations of accelerated\ncomputing.\n\nCooling Infrastructure Built for Higher Density\n\nGreater compute density also requires a fundamental shift in thermal\nmanagement. Compal is expanding its infrastructure portfolio with advanced\nliquid-cooling technologies and megawatt-scale cooling capabilities, enabling\nAI systems to operate efficiently as rack densities continue to rise.\n\nRather than treating compute, power and cooling as separate systems, Compal is\nengineering them as interconnected elements of the AI factory. By considering\nthese technologies together at the rack and data-center level, Compal can\noptimize infrastructure around the requirements of high-performance\naccelerated computing.\n\nEngineering from the Grid to the GPU\n\nTogether, these capabilities represent Compal's evolution beyond individual\nserver platforms toward a broader AI infrastructure strategy. By combining\naccelerated computing, power, cooling and rack-scale integration with global\nengineering and manufacturing resources, Compal is helping customers bridge\nthe gap between advanced AI technology and real-world, large-scale deployment.\n\n\"Building the next generation of AI factories requires us to rethink the\nentire infrastructure surrounding accelerated computing,\" said Alan Chang,\nVice President of ISBG at Compal. \"Compal is bringing together power, cooling,\nrack integration and NVIDIA accelerated computing to help customers build AI\ninfrastructure that can scale efficiently from the platform level to\nmegawatt-scale deployments.\"\n\nAt OCP, Compal will demonstrate how these infrastructure technologies come\ntogether to address the growing power, thermal and deployment challenges of\nthe AI era—engineering the critical infrastructure from the grid to the GPU.\n\nVisit Compal at OCP Global Summit 2026, Booth #E65, to discover the\ninfrastructure behind the next generation of NVIDIA-powered AI factories.\n\nAbout Compal\n\nEstablished in 1984, Compal has grown into a leading global manufacturer of\ncomputers and smart devices, partnering with top-tier brands worldwide. Compal\nwas recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers\nand has consistently ranked among the Forbes Global 2000 companies. Compal has\nactively expanded into new growth areas, including cloud servers, automotive\nelectronics, smart medical and healthcare, and advanced communication\nsolutions. Headquartered in Taipei, Taiwan, Compal operates design and\nproduction facilities in the United States, Taiwan, China, Vietnam, Mexico,\nBrazil, and Poland. Learn more at https://www.compal.com\n\n\n\nView original content to download\nmultimedia:https://www.prnewswire.co.uk/news-releases/compal-brings-nvidia-ai-factory-infrastructure-to-ocp-global-summit-2026-302892755.html\n\n\n\nMedia Inquiries: Jack Wang, Vice president and Spokesperson, +886-2-8797-8588, Investor@compal.com\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS1998292/20260929044617EDT_image_1.jpg?id=OA2976353\nhttps://mmx.prnewswire.com/media/MS1852570/COMPAL-ELECTRONICS-Logo.jpg?id=OA2976354\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved."},"type":"article","timestamp":"2026-09-29T16:00:01.766045882Z","server_sent_at_ms":1790697601766},"received_at":"2026-09-29T16:00:01.817Z","source_url":null},"analysis":null,"durationMs":null,"modelName":null}}