{"success":true,"data":{"pressRelease":{"id":"161312","rtpr_id":"nPNAZD2tLa-20261006","ticker":"SMHNN","exchange":"XETRA","all_tickers":["SMHNN"],"title":"SUSS enters Wafer-Cleaning Market with launch of GreenTec Solutions Product Line and first GT200 System","author":"PR Newswire","published_at":"2026-10-06T08:00:04.672Z","article_body":"SUSS enters Wafer-Cleaning Market with launch of GreenTec Solutions Product\nLine and first GT200 System\nPR Newswire\n\nGARCHING, Germany, Oct. 6, 2026\n* Product portfolio expansion into growing wafer-cleaning market driven by\nadvanced packaging applications\n* GreenTec Solutions enable sustainable wafer cleaning with reduced chemical\nconsumption and without hazardous acids\n* Proven TurbulenStrip™(1) and CrustBuster™(2) technologies extend\nestablished SUSS expertise from photomask processing to wafer-level production\n* GT200 is the first GreenTec Solutions platform, addressing 200 mm process\ndevelopment, qualification, and production applications\n* Scalable roadmap from R&D and qualification to 200 mm and 300 mm high-volume\nmanufacturing\nGARCHING, Germany, Oct. 6, 2026 /PRNewswire/ -- SUSS MicroTec SE (MDAX/TecDAX:\nSMHN), a leading supplier of equipment and process solutions for the\nsemiconductor industry, today announces its entry into the wafer-level\ncleaning market with the launch of the new GreenTec Solutions product line and\nthe introduction of its first system, the GT200.\n\nThe launch expands SUSS' technology portfolio into the growing wafer-cleaning\nmarket, which today represents an addressable market of approximately €5.4\nbillion(3) and is driven by advanced packaging, heterogeneous integration and\nincreasing semiconductor demand from AI and high-performance computing\napplications.\n\n\"GreenTec Solutions marks an important milestone in the execution of our\nAmbition 2030 strategy. By expanding into wafer-level cleaning, we are\nentering an attractive market with significant long-term growth potential\nwhile leveraging proven technologies and process expertise from our existing\nportfolio. Our differentiated approach combines strong cleaning performance,\nsignificantly lower chemical consumption and the elimination of hazardous\nacids. This creates tangible benefits for customers and positions SUSS for\nfuture growth in advanced semiconductor manufacturing,\" says Burkhardt Frick,\nChief Executive Officer of SUSS.\n\nProven SUSS technology as a competitive differentiator addressing ESG-needs of\nthe semiconductor industry\n\nAt the core of the portfolio is a hybrid cleaning approach that combines the\nproven SUSS process technologies TurbulenStrip™ and CrustBuster™ from the\nPhotomask Solutions segment in a single platform. TurbulenStrip™\nincorporates lower-impact batch soaking and single-wafer handling for\nefficient resist and residue removal, while CrustBuster™ utilizes patented\nin-situ UV technology to break down and remove organic materials directly at\nthe wafer surface in a single-wafer process chamber. Together, these\ntechnologies enable highly efficient residue removal and process stability\nwhile helping customers reduce chemical consumption, support their\nsustainability targets, and lower overall cost-of-ownership.\n\nThe GT200 is specifically designed for research and development, process\nqualification, and production in 200 mm manufacturing environments for\nMEMS(4), RF(5), Power Device and CMOS(6) applications. In addition to\nequipment supply, SUSS supports customers through joint evaluation programs,\nprocess co-development and recipe optimization services to accelerate\nadoption, improve process stability and de-risk technology transfers ahead of\nvolume production ramps.\n\nClear roadmap toward high-volume manufacturing\n\nFollowing SUSS' strategic approach, all platforms of the GreenTec Solutions\nproduct line are designed with a focus on a high degree of modularization and\nstandardization with the GT200 serving as the first member of a scalable\nGreenTec platform. SUSS will expand its portfolio toward high-volume\nmanufacturing (HVM) with a dedicated 300 mm HVM platform in 2027.\n\n\"The GreenTec Solutions product line represents our vision for the next\ngeneration of semiconductor manufacturing—where sustainability and process\nexcellence go hand in hand. We are building on decades of experience in\ndemanding photomask applications and transferring this expertise now into\neco-friendly wafer-level manufacturing. Together with customers and partners,\nwe develop process solutions that support the next generation of\nmicroelectronics with a clear focus on reliability, innovation, and\nresponsible resource use. Due to the strong interest from our customers, we\nare pulling in the launch of a 300 mm HVM solution,\" explains Yuta Nagai,\nSenior Vice President Photomask Solutions at SUSS. A 200 mm HVM platform will\nfollow in 2028. This provides customers with a clear migration path from\nevaluation to full-scale production.\n\nPlease find more information about the GT200 at\nhttps://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200 \n\nMeet SUSS at SEMICON West \n\nDiscover the latest developments in wafer-level cleaning and join our Product\nDeep Dives at SEMICON West.\n\nRegister now: https://www.suss.com/en/company/events/semicon-west \n\n(1) TurbulenStrip™ is a trademark of SUSS MicroTec SE\n\n(2) CrustBuster™ is a trademark of SUSS MicroTec SE\n\n(3) Source: SUSS Research, Yole\n\n(4) Micro-Electro-Mechanical Systems\n\n(5) Radio Frequency\n\n(6) Complementary metal–oxide–semiconductor\n\nContact\n\nSabrina Müller\nVice President Investor Relations & Communications\nsabrina.mueller@suss.com\n+49 160 94989008\nwww.suss.com\n\nAbout the GT200\n\nThe GT200 is an eco-friendly manufacturing solution for wafer cleaning and\nstripping processes. It combines photoresist removal, surface activation, and\nfinal cleaning in one configurable platform, helping fabs reduce tool\nfragmentation, simplify process flows, and improve operational efficiency.\n\nBy combining greener process media with advanced technologies adapted from\nproven solutions developed by SUSS's Photomask Solutions business unit, the\nGT200 supports shorter process learning cycles, reduced EHS exposure, and\nlower chemical consumption and hazardous waste generation — without\ncompromising process performance. Its flexible hybrid concept consolidates\nmultiple cleaning and stripping steps, reducing wafer transfers and toolset\ncomplexity.\n\nSUSS supports customers throughout implementation with co-development, recipe\ntuning, and a structured Joint Evaluation Program. This helps accelerate\nadoption, strengthen process stability, and transfer process know-how from\npilot and qualification phases into high-volume manufacturing.\n\nAbout SUSS\n\nSUSS is a leading global provider of equipment and process solutions for the\nsemiconductor industry. Focused on cutting-edge technology and precision\nengineering, we enable the production of next-generation microchips and\nsemiconductor devices that power digital progress. Developed in close\ncollaboration with research institutes and industry partners, our solutions\nfuel the AI and high-performance computing ecosystem and shape the future of\nintelligent devices and applications worldwide.\n\nHeadquartered in Garching, Germany, SUSS has approximately 1,500 employees\nworldwide and recently generated sales of approximately €500 million. We\noperate production sites in Germany and Taiwan region and development centers\nin Europe, Asia, and the US, supported by a strong network of sales and\nservice offices with close proximity to our customers. SUSS MicroTec SE is\nlisted on the Frankfurt Stock Exchange (Prime Standard, FWB: SMHN; ISIN\nDE000A1K0235) and is part of the TecDAX and MDAX indices. For more\ninformation, visit www.suss.com.\n\nLegal Disclaimer\n\nCertain statements made in this release are forward-looking statements or may\nbe construed as such. All information and assessments are based on extremely\ndiligent research. However, this publication is made without a warranty. Any\nliability is excluded. The above statements do not constitute an offer to buy\nor sell securities. All rights reserved.\n\nSOURCE SUSS MicroTec SE\n\n\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved.","article_body_html":"","raw_payload":{"data":{"id":"nPNAZD2tLa-20261006","title":"SUSS enters Wafer-Cleaning Market with launch of GreenTec Solutions Product Line and first GT200 System","author":"PR Newswire","ticker":"SMHNN","created":"2026-10-06T08:00:04.672Z","tickers":["SMHNN"],"exchange":"XETRA","article_body":"SUSS enters Wafer-Cleaning Market with launch of GreenTec Solutions Product\nLine and first GT200 System\nPR Newswire\n\nGARCHING, Germany, Oct. 6, 2026\n* Product portfolio expansion into growing wafer-cleaning market driven by\nadvanced packaging applications\n* GreenTec Solutions enable sustainable wafer cleaning with reduced chemical\nconsumption and without hazardous acids\n* Proven TurbulenStrip™(1) and CrustBuster™(2) technologies extend\nestablished SUSS expertise from photomask processing to wafer-level production\n* GT200 is the first GreenTec Solutions platform, addressing 200 mm process\ndevelopment, qualification, and production applications\n* Scalable roadmap from R&D and qualification to 200 mm and 300 mm high-volume\nmanufacturing\nGARCHING, Germany, Oct. 6, 2026 /PRNewswire/ -- SUSS MicroTec SE (MDAX/TecDAX:\nSMHN), a leading supplier of equipment and process solutions for the\nsemiconductor industry, today announces its entry into the wafer-level\ncleaning market with the launch of the new GreenTec Solutions product line and\nthe introduction of its first system, the GT200.\n\nThe launch expands SUSS' technology portfolio into the growing wafer-cleaning\nmarket, which today represents an addressable market of approximately €5.4\nbillion(3) and is driven by advanced packaging, heterogeneous integration and\nincreasing semiconductor demand from AI and high-performance computing\napplications.\n\n\"GreenTec Solutions marks an important milestone in the execution of our\nAmbition 2030 strategy. By expanding into wafer-level cleaning, we are\nentering an attractive market with significant long-term growth potential\nwhile leveraging proven technologies and process expertise from our existing\nportfolio. Our differentiated approach combines strong cleaning performance,\nsignificantly lower chemical consumption and the elimination of hazardous\nacids. This creates tangible benefits for customers and positions SUSS for\nfuture growth in advanced semiconductor manufacturing,\" says Burkhardt Frick,\nChief Executive Officer of SUSS.\n\nProven SUSS technology as a competitive differentiator addressing ESG-needs of\nthe semiconductor industry\n\nAt the core of the portfolio is a hybrid cleaning approach that combines the\nproven SUSS process technologies TurbulenStrip™ and CrustBuster™ from the\nPhotomask Solutions segment in a single platform. TurbulenStrip™\nincorporates lower-impact batch soaking and single-wafer handling for\nefficient resist and residue removal, while CrustBuster™ utilizes patented\nin-situ UV technology to break down and remove organic materials directly at\nthe wafer surface in a single-wafer process chamber. Together, these\ntechnologies enable highly efficient residue removal and process stability\nwhile helping customers reduce chemical consumption, support their\nsustainability targets, and lower overall cost-of-ownership.\n\nThe GT200 is specifically designed for research and development, process\nqualification, and production in 200 mm manufacturing environments for\nMEMS(4), RF(5), Power Device and CMOS(6) applications. In addition to\nequipment supply, SUSS supports customers through joint evaluation programs,\nprocess co-development and recipe optimization services to accelerate\nadoption, improve process stability and de-risk technology transfers ahead of\nvolume production ramps.\n\nClear roadmap toward high-volume manufacturing\n\nFollowing SUSS' strategic approach, all platforms of the GreenTec Solutions\nproduct line are designed with a focus on a high degree of modularization and\nstandardization with the GT200 serving as the first member of a scalable\nGreenTec platform. SUSS will expand its portfolio toward high-volume\nmanufacturing (HVM) with a dedicated 300 mm HVM platform in 2027.\n\n\"The GreenTec Solutions product line represents our vision for the next\ngeneration of semiconductor manufacturing—where sustainability and process\nexcellence go hand in hand. We are building on decades of experience in\ndemanding photomask applications and transferring this expertise now into\neco-friendly wafer-level manufacturing. Together with customers and partners,\nwe develop process solutions that support the next generation of\nmicroelectronics with a clear focus on reliability, innovation, and\nresponsible resource use. Due to the strong interest from our customers, we\nare pulling in the launch of a 300 mm HVM solution,\" explains Yuta Nagai,\nSenior Vice President Photomask Solutions at SUSS. A 200 mm HVM platform will\nfollow in 2028. This provides customers with a clear migration path from\nevaluation to full-scale production.\n\nPlease find more information about the GT200 at\nhttps://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200 \n\nMeet SUSS at SEMICON West \n\nDiscover the latest developments in wafer-level cleaning and join our Product\nDeep Dives at SEMICON West.\n\nRegister now: https://www.suss.com/en/company/events/semicon-west \n\n(1) TurbulenStrip™ is a trademark of SUSS MicroTec SE\n\n(2) CrustBuster™ is a trademark of SUSS MicroTec SE\n\n(3) Source: SUSS Research, Yole\n\n(4) Micro-Electro-Mechanical Systems\n\n(5) Radio Frequency\n\n(6) Complementary metal–oxide–semiconductor\n\nContact\n\nSabrina Müller\nVice President Investor Relations & Communications\nsabrina.mueller@suss.com\n+49 160 94989008\nwww.suss.com\n\nAbout the GT200\n\nThe GT200 is an eco-friendly manufacturing solution for wafer cleaning and\nstripping processes. It combines photoresist removal, surface activation, and\nfinal cleaning in one configurable platform, helping fabs reduce tool\nfragmentation, simplify process flows, and improve operational efficiency.\n\nBy combining greener process media with advanced technologies adapted from\nproven solutions developed by SUSS's Photomask Solutions business unit, the\nGT200 supports shorter process learning cycles, reduced EHS exposure, and\nlower chemical consumption and hazardous waste generation — without\ncompromising process performance. Its flexible hybrid concept consolidates\nmultiple cleaning and stripping steps, reducing wafer transfers and toolset\ncomplexity.\n\nSUSS supports customers throughout implementation with co-development, recipe\ntuning, and a structured Joint Evaluation Program. This helps accelerate\nadoption, strengthen process stability, and transfer process know-how from\npilot and qualification phases into high-volume manufacturing.\n\nAbout SUSS\n\nSUSS is a leading global provider of equipment and process solutions for the\nsemiconductor industry. Focused on cutting-edge technology and precision\nengineering, we enable the production of next-generation microchips and\nsemiconductor devices that power digital progress. Developed in close\ncollaboration with research institutes and industry partners, our solutions\nfuel the AI and high-performance computing ecosystem and shape the future of\nintelligent devices and applications worldwide.\n\nHeadquartered in Garching, Germany, SUSS has approximately 1,500 employees\nworldwide and recently generated sales of approximately €500 million. We\noperate production sites in Germany and Taiwan region and development centers\nin Europe, Asia, and the US, supported by a strong network of sales and\nservice offices with close proximity to our customers. SUSS MicroTec SE is\nlisted on the Frankfurt Stock Exchange (Prime Standard, FWB: SMHN; ISIN\nDE000A1K0235) and is part of the TecDAX and MDAX indices. For more\ninformation, visit www.suss.com.\n\nLegal Disclaimer\n\nCertain statements made in this release are forward-looking statements or may\nbe construed as such. All information and assessments are based on extremely\ndiligent research. However, this publication is made without a warranty. Any\nliability is excluded. The above statements do not constitute an offer to buy\nor sell securities. All rights reserved.\n\nSOURCE SUSS MicroTec SE\n\n\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved."},"type":"article","timestamp":"2026-10-06T08:00:04.707796172Z","server_sent_at_ms":1791273604707},"received_at":"2026-10-06T08:00:04.758Z","source_url":null},"analysis":null,"durationMs":null,"modelName":null}}