{"success":true,"data":{"pressRelease":{"id":"162585","rtpr_id":"nPre63jpDa-20261007","ticker":"IZMO","exchange":"NSE India","all_tickers":["IZMO"],"title":"izmo Microsystems and IIT Madras Enter Phase II of ₹99.94 Crore MeitY-Sanctioned Silicon Photonics Program","author":"PR Newswire","published_at":"2026-10-07T05:30:53.032Z","article_body":"izmo Microsystems and IIT Madras Enter Phase II of ₹99.94 Crore\nMeitY-Sanctioned Silicon Photonics Program\nPR Newswire\n\nBENGALURU, India, Oct. 7, 2026\n\nFive-year CPPICS SPECTRA program targets 1.6 Tbps optical transceivers,\nco-packaged optics, quantum communications and photonic AI\n\nBENGALURU, India, Oct. 7, 2026 /PRNewswire/ -- izmo Limited (NSE: IZMO) (BSE:\n532341) today announced that its semiconductor subsidiary, izmo Microsystems\nPvt. Ltd., has entered into a Memorandum of Understanding with the Indian\nInstitute of Technology Madras (IIT Madras) for Phase II of the Centre for\nProgrammable Photonic Integrated Circuits and Systems (CPPICS).\n\n\nThe Phase II program, titled Silicon Photonics Enabled Cutting-edge Technology\nResearch and Applications (SPECTRA), has been sanctioned by the Ministry of\nElectronics and Information Technology (MeitY), Government of India, with a\ntotal project outlay of ₹99.94 crore. The five-year program includes a MeitY\ncontribution of ₹97.54 crore and a ₹2.40 crore cash and in-kind commitment\nfrom izmo Microsystems.\n\nCPPICS Phase II is designed to advance silicon photonics technologies from\nresearch towards commercially deployable products, covering photonic\nintegrated circuit design, fabrication, characterization, advanced packaging,\ntesting and system integration.\n\nSilicon Photonics for the AI infrastructure era\n\nThe program comes at a time when optical connectivity is becoming critical\ninfrastructure for AI and high-performance computing.\n\nAs GPU and accelerator clusters scale, data-center networks require\nsubstantially higher bandwidth while controlling power consumption, latency\nand interconnect density. This is driving the transition towards 800G and 1.6T\noptical interconnects, silicon photonics and, increasingly, co-packaged optics\n(CPO).\n\nAccording to LightCounting, global sales of optical transceivers and related\nproducts reached $26.8 billion in 2025, up 74% year-on-year. The research firm\nestimates the optical transceiver market at approximately $40 billion in 2026,\nwith silicon-photonics-based transceivers expected to represent more than half\nof the market for the first time.\n\nLightCounting further estimates that the market for optical chips used across\ntransceivers, active optical cables and near- and co-packaged optics could\ngrow from approximately $4 billion in 2025 to $15 billion by 2031.\n\nThe transition is already moving into commercial infrastructure, with major\nnetworking and semiconductor companies introducing silicon-photonics-based\nco-packaged-optics platforms for large AI clusters.\n\nTargeting 1.6 Tbps optical engines and co-packaged optics\n\nCPPICS Phase II targets commercially viable photonic technologies across four\nmajor application areas: high-speed optical transceivers for data centers,\nmicrowave photonics for advanced wireless communications, quantum photonics,\nand photonic computing for AI.\n\nAmong the planned developments is a 1.6 Tbps silicon photonics transceiver\nengine operating at 1550 nm for high-performance computing and data-center\nrouting. The project also targets microwave photonic engines operating beyond\n50 GHz, integrated QRNG/QKD systems and photonic processors for AI workloads.\n\nThe program also proposes development of a silicon photonics Process Design\nKit incorporating more than 100 IP blocks for 200 mm wafer platforms,\nsupporting the design and manufacture of increasingly complex photonic\nintegrated circuits.\n\nizmo Microsystems to drive packaging and industrialization\n\nA key challenge in silicon photonics is converting a fabricated photonic chip\ninto a reliable and manufacturable optical system.\n\nCPPICS Phase II specifically envisages development of a volume photonics\npackaging ecosystem in collaboration with izmo Microsystems, addressing\nprecision assembly, photonic packaging, testing and reliability required for\ncommercial deployment.\n\nUnder the program, izmo Microsystems' role progresses from packaging\narchitecture and CPO interface definition to PIC-EIC co-integration, fiber\nalignment and attachment, production-grade packaging, process optimization,\nprototype assembly and reliability validation.\n\nThe five-year roadmap ultimately targets a certified co-packaged optics design\nrule and service capability, creating a pathway from silicon photonics\nresearch and foundry fabrication through packaging, qualification and\nsystem-level deployment.\n\nDinanath Soni, Director, izmo Microsystems Pvt. Ltd., said:\n\n\"Silicon photonics is becoming a critical technology for the next generation\nof AI and data-center infrastructure as network speeds move from 400G and 800G\ntowards 1.6T and beyond.\n\nThe challenge is no longer only designing the photonic chip. Converting that\nchip into a reliable product requires precision packaging, fiber attachment,\nelectronic-photonic integration, thermal management and high-speed testing.\n\nCPPICS Phase II brings together IIT Madras' silicon photonics research\ncapabilities with izmo Microsystems' advanced packaging and manufacturing\nexpertise. Our role is to help move these technologies from research\nprototypes towards production-ready modules and co-packaged optical systems.\"\n\nBuilding on CPPICS Phase I\n\nCPPICS Phase II builds on the first phase of the program, which achieved more\nthan 95% of its planned milestones and generated research, IP and prototypes\nacross programmable photonics, microwave photonics and quantum technologies.\n\nPhase II expands the program toward technology translation, industrialization\nand commercialization, with applications spanning data centers,\ntelecommunications, defence, quantum technologies and advanced computing.\n\nThrough the collaboration, izmo Microsystems intends to strengthen its\nadvanced photonic packaging capabilities and participate in the emerging\nglobal market for silicon photonics, high-speed optical interconnects and\nco-packaged optics for AI and high-performance computing infrastructure.\n\nAbout izmo Microsystems Pvt. Ltd.\n\nizmo Microsystems Pvt. Ltd., a subsidiary of izmo Limited, is an advanced\nsemiconductor packaging and manufacturing company based in Bengaluru, India.\nThe company provides semiconductor package design, development, prototyping,\nqualification and manufacturing capabilities across advanced IC packaging,\nSystem-in-Package, RF and microwave packaging, and silicon photonics and\noptical packaging.\n\nFor more information, visit www.izmomicro.com / www.izmoltd.com or contact:\n\nInvestor Contact\n\nizmo Limited\nNo. 177/2C, Bilekahalli Industrial Area, Bannerghatta Road, Bangalore 560076\nCIN: L72200KA1995PLC018734\nEmail ID: investors@izmoltd.com \n\nCaution Concerning Forward- Looking Statements: Certain statements in this\ndocument may be forward-looking statements. Such forward-looking statements\nare subject to certain risks and uncertainties like regulatory changes, local\npolitical or economic developments, and many other factors that could cause\nour actual results to differ materially from those contemplated by the\nrelevant forward-looking statements. Further, past performance is not\nnecessarily indicative of future results. Given these risks, uncertainties and\nother risk factors, viewers are cautioned not to place undue reliance on these\nforward-looking statements. The Company will not be in any way responsible for\nany action taken based on such statements and undertakes no obligation to\npublicly update these forward-looking statements to reflect subsequent events\nor circumstances. \n\n \n\nView original content to download\nmultimedia:https://www.prnewswire.com/in/news-releases/izmo-microsystems-and-iit-madras-enter-phase-ii-of-99-94-crore-meity-sanctioned-silicon-photonics-program-302900769.html\n\n\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS1660297/izmoltd-logo.jpg?id=OA2991677\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved.","article_body_html":"","raw_payload":{"data":{"id":"nPre63jpDa-20261007","title":"izmo Microsystems and IIT Madras Enter Phase II of ₹99.94 Crore MeitY-Sanctioned Silicon Photonics Program","author":"PR Newswire","ticker":"IZMO","created":"2026-10-07T05:30:53.032Z","tickers":["IZMO"],"exchange":"NSE India","article_body":"izmo Microsystems and IIT Madras Enter Phase II of ₹99.94 Crore\nMeitY-Sanctioned Silicon Photonics Program\nPR Newswire\n\nBENGALURU, India, Oct. 7, 2026\n\nFive-year CPPICS SPECTRA program targets 1.6 Tbps optical transceivers,\nco-packaged optics, quantum communications and photonic AI\n\nBENGALURU, India, Oct. 7, 2026 /PRNewswire/ -- izmo Limited (NSE: IZMO) (BSE:\n532341) today announced that its semiconductor subsidiary, izmo Microsystems\nPvt. Ltd., has entered into a Memorandum of Understanding with the Indian\nInstitute of Technology Madras (IIT Madras) for Phase II of the Centre for\nProgrammable Photonic Integrated Circuits and Systems (CPPICS).\n\n\nThe Phase II program, titled Silicon Photonics Enabled Cutting-edge Technology\nResearch and Applications (SPECTRA), has been sanctioned by the Ministry of\nElectronics and Information Technology (MeitY), Government of India, with a\ntotal project outlay of ₹99.94 crore. The five-year program includes a MeitY\ncontribution of ₹97.54 crore and a ₹2.40 crore cash and in-kind commitment\nfrom izmo Microsystems.\n\nCPPICS Phase II is designed to advance silicon photonics technologies from\nresearch towards commercially deployable products, covering photonic\nintegrated circuit design, fabrication, characterization, advanced packaging,\ntesting and system integration.\n\nSilicon Photonics for the AI infrastructure era\n\nThe program comes at a time when optical connectivity is becoming critical\ninfrastructure for AI and high-performance computing.\n\nAs GPU and accelerator clusters scale, data-center networks require\nsubstantially higher bandwidth while controlling power consumption, latency\nand interconnect density. This is driving the transition towards 800G and 1.6T\noptical interconnects, silicon photonics and, increasingly, co-packaged optics\n(CPO).\n\nAccording to LightCounting, global sales of optical transceivers and related\nproducts reached $26.8 billion in 2025, up 74% year-on-year. The research firm\nestimates the optical transceiver market at approximately $40 billion in 2026,\nwith silicon-photonics-based transceivers expected to represent more than half\nof the market for the first time.\n\nLightCounting further estimates that the market for optical chips used across\ntransceivers, active optical cables and near- and co-packaged optics could\ngrow from approximately $4 billion in 2025 to $15 billion by 2031.\n\nThe transition is already moving into commercial infrastructure, with major\nnetworking and semiconductor companies introducing silicon-photonics-based\nco-packaged-optics platforms for large AI clusters.\n\nTargeting 1.6 Tbps optical engines and co-packaged optics\n\nCPPICS Phase II targets commercially viable photonic technologies across four\nmajor application areas: high-speed optical transceivers for data centers,\nmicrowave photonics for advanced wireless communications, quantum photonics,\nand photonic computing for AI.\n\nAmong the planned developments is a 1.6 Tbps silicon photonics transceiver\nengine operating at 1550 nm for high-performance computing and data-center\nrouting. The project also targets microwave photonic engines operating beyond\n50 GHz, integrated QRNG/QKD systems and photonic processors for AI workloads.\n\nThe program also proposes development of a silicon photonics Process Design\nKit incorporating more than 100 IP blocks for 200 mm wafer platforms,\nsupporting the design and manufacture of increasingly complex photonic\nintegrated circuits.\n\nizmo Microsystems to drive packaging and industrialization\n\nA key challenge in silicon photonics is converting a fabricated photonic chip\ninto a reliable and manufacturable optical system.\n\nCPPICS Phase II specifically envisages development of a volume photonics\npackaging ecosystem in collaboration with izmo Microsystems, addressing\nprecision assembly, photonic packaging, testing and reliability required for\ncommercial deployment.\n\nUnder the program, izmo Microsystems' role progresses from packaging\narchitecture and CPO interface definition to PIC-EIC co-integration, fiber\nalignment and attachment, production-grade packaging, process optimization,\nprototype assembly and reliability validation.\n\nThe five-year roadmap ultimately targets a certified co-packaged optics design\nrule and service capability, creating a pathway from silicon photonics\nresearch and foundry fabrication through packaging, qualification and\nsystem-level deployment.\n\nDinanath Soni, Director, izmo Microsystems Pvt. Ltd., said:\n\n\"Silicon photonics is becoming a critical technology for the next generation\nof AI and data-center infrastructure as network speeds move from 400G and 800G\ntowards 1.6T and beyond.\n\nThe challenge is no longer only designing the photonic chip. Converting that\nchip into a reliable product requires precision packaging, fiber attachment,\nelectronic-photonic integration, thermal management and high-speed testing.\n\nCPPICS Phase II brings together IIT Madras' silicon photonics research\ncapabilities with izmo Microsystems' advanced packaging and manufacturing\nexpertise. Our role is to help move these technologies from research\nprototypes towards production-ready modules and co-packaged optical systems.\"\n\nBuilding on CPPICS Phase I\n\nCPPICS Phase II builds on the first phase of the program, which achieved more\nthan 95% of its planned milestones and generated research, IP and prototypes\nacross programmable photonics, microwave photonics and quantum technologies.\n\nPhase II expands the program toward technology translation, industrialization\nand commercialization, with applications spanning data centers,\ntelecommunications, defence, quantum technologies and advanced computing.\n\nThrough the collaboration, izmo Microsystems intends to strengthen its\nadvanced photonic packaging capabilities and participate in the emerging\nglobal market for silicon photonics, high-speed optical interconnects and\nco-packaged optics for AI and high-performance computing infrastructure.\n\nAbout izmo Microsystems Pvt. Ltd.\n\nizmo Microsystems Pvt. Ltd., a subsidiary of izmo Limited, is an advanced\nsemiconductor packaging and manufacturing company based in Bengaluru, India.\nThe company provides semiconductor package design, development, prototyping,\nqualification and manufacturing capabilities across advanced IC packaging,\nSystem-in-Package, RF and microwave packaging, and silicon photonics and\noptical packaging.\n\nFor more information, visit www.izmomicro.com / www.izmoltd.com or contact:\n\nInvestor Contact\n\nizmo Limited\nNo. 177/2C, Bilekahalli Industrial Area, Bannerghatta Road, Bangalore 560076\nCIN: L72200KA1995PLC018734\nEmail ID: investors@izmoltd.com \n\nCaution Concerning Forward- Looking Statements: Certain statements in this\ndocument may be forward-looking statements. Such forward-looking statements\nare subject to certain risks and uncertainties like regulatory changes, local\npolitical or economic developments, and many other factors that could cause\nour actual results to differ materially from those contemplated by the\nrelevant forward-looking statements. Further, past performance is not\nnecessarily indicative of future results. Given these risks, uncertainties and\nother risk factors, viewers are cautioned not to place undue reliance on these\nforward-looking statements. The Company will not be in any way responsible for\nany action taken based on such statements and undertakes no obligation to\npublicly update these forward-looking statements to reflect subsequent events\nor circumstances. \n\n \n\nView original content to download\nmultimedia:https://www.prnewswire.com/in/news-releases/izmo-microsystems-and-iit-madras-enter-phase-ii-of-99-94-crore-meity-sanctioned-silicon-photonics-program-302900769.html\n\n\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS1660297/izmoltd-logo.jpg?id=OA2991677\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved."},"type":"article","timestamp":"2026-10-07T05:30:53.075321802Z","server_sent_at_ms":1791351053075},"received_at":"2026-10-07T05:30:53.125Z","source_url":"https://www.prnewswire.com/in/news-releases/izmo-microsystems-and-iit-madras-enter-phase-ii-of-99-94-crore-meity-sanctioned-silicon-photonics-program-302900769.html"},"analysis":{"id":"151066","press_release_id":"162585","analysis_json":{"industry":{"label":"Semiconductors & Semiconductor Equipment","sector":"Information Technology"},"redFlags":["izmo's direct financial commitment is small (₹2.40 crore); program commercialization is years away with no revenue guidance","market-size figures cited from LightCounting are third-party projections, not izmo-specific opportunity"],"eventType":"partnership","narrative":"izmo Limited's semiconductor subsidiary izmo Microsystems has entered Phase II of the MeitY-sanctioned CPPICS SPECTRA silicon photonics program with IIT Madras under a new MoU.\n\nThe five-year program carries a total outlay of ₹99.94 crore, of which MeitY contributes ₹97.54 crore and izmo Microsystems commits ₹2.40 crore in cash and in-kind, targeting 1.6 Tbps optical transceivers, co-packaged optics, quantum communications and photonic AI.\n\nizmo's role focuses on volume photonics packaging, fiber alignment, PIC-EIC co-integration and reliability validation — building on Phase I, which achieved more than 95% of planned milestones.\n\nThe work positions izmo in the emerging co-packaged optics supply chain for AI data centers, though commercialization is multi-year and near-term revenue impact is modest.","sentiment":"bullish","agentHooks":{"shouldPost":true,"suggestedAngle":"Government-funded silicon photonics program gives small-cap izmo a credible entry into the co-packaged optics packaging ecosystem for AI infrastructure."},"keyFigures":{"customDimensions":{"project_outlay_inr":"₹99.94 crore","izmo_commitment_inr":"₹2.40 crore","meity_contribution_inr":"₹97.54 crore","program_duration_years":5,"optical_chip_market_2025":"$4 billion","target_transceiver_speed":"1.6 Tbps","optical_chip_market_2031_est":"$15 billion","phase1_milestone_achievement":"more than 95%","optical_transceiver_market_2025":"$26.8 billion","optical_transceiver_market_2026_est":"$40 billion"}},"quotedText":"Silicon photonics is becoming a critical technology for the next generation of AI and data-center infrastructure as network speeds move from 400G and 800G towards 1.6T and beyond.","namedEntities":{"people":[{"name":"Dinanath Soni","role":"Director, izmo Microsystems Pvt. Ltd."}],"products":["CPPICS Phase II SPECTRA","1.6 Tbps silicon photonics transceiver engine","silicon photonics Process Design Kit"],"companies":[{"name":"izmo Limited","ticker":"IZMO","relationship":"filer / parent"},{"name":"izmo Microsystems Pvt. Ltd.","relationship":"semiconductor packaging subsidiary"},{"name":"IIT Madras","relationship":"research partner"},{"name":"Ministry of Electronics and Information Technology (MeitY)","relationship":"government funding agency"},{"name":"LightCounting","relationship":"market research firm cited"}],"dollarAmounts":[{"amount":"$26.8 billion","context":"global optical transceiver sales in 2025, per LightCounting"},{"amount":"$40 billion","context":"estimated optical transceiver market in 2026"},{"amount":"$4 billion","context":"estimated optical chip market in 2025"},{"amount":"$15 billion","context":"estimated optical chip market by 2031"}]},"materialImpact":{"score":3,"reasoning":"A ₹99.94 crore (~$11-12M) government-sanctioned five-year silicon photonics program with IIT Madras positions izmo's packaging subsidiary in the strategically important co-packaged optics supply chain, but the near-term revenue contribution is small (₹2.40 crore izmo commitment) and commercialization is years out."},"tickerRelevance":{"others":[],"primary":"IZMO"},"globalImportance":25,"audienceRelevance":30,"eventTypeSecondary":["operations_update"],"importanceComponents":{"tickerTier":"small-cap (India-listed)","eventGravity":"government-backed R&D partnership, modest direct financial commitment","sectorWeight":"silicon photonics / AI optics tailwind","retailFavoriteBoost":"minor — AI infrastructure theme resonance"}},"event_type":"partnership","event_type_secondary":["operations_update"],"sentiment":"bullish","material_impact_score":3,"narrative":"izmo Limited's semiconductor subsidiary izmo Microsystems has entered Phase II of the MeitY-sanctioned CPPICS SPECTRA silicon photonics program with IIT Madras under a new MoU.\n\nThe five-year program carries a total outlay of ₹99.94 crore, of which MeitY contributes ₹97.54 crore and izmo Microsystems commits ₹2.40 crore in cash and in-kind, targeting 1.6 Tbps optical transceivers, co-packaged optics, quantum communications and photonic AI.\n\nizmo's role focuses on volume photonics packaging, fiber alignment, PIC-EIC co-integration and reliability validation — building on Phase I, which achieved more than 95% of planned milestones.\n\nThe work positions izmo in the emerging co-packaged optics supply chain for AI data centers, though commercialization is multi-year and near-term revenue impact is modest.","key_figures":{"customDimensions":{"project_outlay_inr":"₹99.94 crore","izmo_commitment_inr":"₹2.40 crore","meity_contribution_inr":"₹97.54 crore","program_duration_years":5,"optical_chip_market_2025":"$4 billion","target_transceiver_speed":"1.6 Tbps","optical_chip_market_2031_est":"$15 billion","phase1_milestone_achievement":"more than 95%","optical_transceiver_market_2025":"$26.8 billion","optical_transceiver_market_2026_est":"$40 billion"}},"named_entities":{"people":[{"name":"Dinanath Soni","role":"Director, izmo Microsystems Pvt. Ltd."}],"products":["CPPICS Phase II SPECTRA","1.6 Tbps silicon photonics transceiver engine","silicon photonics Process Design Kit"],"companies":[{"name":"izmo Limited","ticker":"IZMO","relationship":"filer / parent"},{"name":"izmo Microsystems Pvt. Ltd.","relationship":"semiconductor packaging subsidiary"},{"name":"IIT Madras","relationship":"research partner"},{"name":"Ministry of Electronics and Information Technology (MeitY)","relationship":"government funding agency"},{"name":"LightCounting","relationship":"market research firm cited"}],"dollarAmounts":[{"amount":"$26.8 billion","context":"global optical transceiver sales in 2025, per LightCounting"},{"amount":"$40 billion","context":"estimated optical transceiver market in 2026"},{"amount":"$4 billion","context":"estimated optical chip market in 2025"},{"amount":"$15 billion","context":"estimated optical chip market by 2031"}]},"model_name":"glm-5.3-flashx","prompt_hash":"sha256:5c812bd9e28b810d","schema_hash":"sha256:05005c02d9cffac9","created_at":"2026-10-07T05:31:00.723Z","global_importance":25,"audience_relevance":30,"importance_components":{"tickerTier":"small-cap (India-listed)","eventGravity":"government-backed R&D partnership, modest direct financial commitment","sectorWeight":"silicon photonics / AI optics tailwind","retailFavoriteBoost":"minor — AI infrastructure theme resonance"}},"durationMs":7582,"modelName":"glm-5.3-flashx"}}