{"success":true,"data":{"pressRelease":{"id":"168852","rtpr_id":"nPn4snn5Xa-20261014","ticker":"IBM","exchange":"NYSE","all_tickers":["IBM"],"title":"IBM and Siemens Collaborate on Research to Advance Nanostack Architecture","author":"PR Newswire","published_at":"2026-10-14T12:00:06.082Z","article_body":"IBM and Siemens Collaborate on Research to Advance Nanostack Architecture\nPR Newswire\n\nALBANY, N.Y., Oct. 14, 2026\n\nCollaboration aims to accelerate development of the manufacturing and design\ncapabilities needed for future nanostack generations\n\nALBANY, N.Y., Oct. 14, 2026 /PRNewswire/ -- Today, IBM (NYSE: IBM\n(https://www.ibm.com/investor/) ), in collaboration with Siemens, announced\nnew research aimed at advancing IBM's nanostack architecture\n(https://research.ibm.com/blog/what-is-a-nanostack) , a new transistor\narchitecture unveiled by IBM earlier this year. The collaboration will bring\ntogether IBM's leadership in semiconductor device innovation and Siemens'\nexpertise in electronic design automation (EDA), process simulation,\nlithography optimization, and advanced manufacturing software to accelerate\nthe development of nanostack.\n\nNanostack is the industry's first known three-dimensional, nanosheet-based\ndesign, vertically stacking and staggering transistors to pack more\ntransistors onto a chip, with nearly 100 billion transistors in a space the\nsize of a fingernail at its current 7 angstrom node. The design also unlocks\nthe use of different material combinations within each stacked layer to\noptimize performance and power efficiency of each transistor independent of\nthe other. These innovations power substantial leaps in energy efficiency,\nperformance, and SRAM scaling.\n\nEarlier this year, IBM demonstrated the viability of the nanostack\narchitecture. Now, additional advances are needed to prepare the technology\nfor manufacturing and production at scale.\n\nThrough this collaboration, IBM and Siemens will work to advance the design,\nsimulation, and lithography techniques needed for this and future nanostack\ngenerations beyond the current 7 angstrom node. The collaboration includes\ndeveloping advanced virtual models of nanostack in order to model performance,\noptimize designs, and address fabrication challenges before chips are built.\n\n\"Nanostack is a scalable transistor platform designed to shift device scaling\nfrom 2D to 3D, representing a new paradigm for the semiconductor industry and\na path forward for the logic scaling needed to support AI and other emerging\ntechnologies over the coming decade,\" said Huiming Bu, Vice President of\nSilicon Technology R&D, IBM. \"We are thrilled to work with Siemens as we\ncontinue to advance this technology and explore new approaches to extend\nangstrom-level scaling with nanostack.\"\n\n\"Scaling semiconductors into the angstrom era demands tightly coupled\nco-optimization between device physics, EDA design and manufacturing software,\nand manufacturing. As physical AI places extraordinary demands on silicon\narchitecture, IBM's 3D nanostack design represents a pivotal leap forward,\"\nsaid Ankur Gupta, Executive Vice President, EDA IC Portfolio, Siemens.\n\"Siemens' collaboration with IBM to advance virtual modeling, simulation,\nlithography, and design software optimizations needed to address physical\nlimitations early and accelerate the development of these complex\narchitectures is truly pioneering.\"\n\nBy combining IBM's semiconductor leadership with Siemens' advanced EDA\nsoftware and simulation technologies, the companies aim to accelerate\ntechnology development cycles and advance the manufacturing foundation\nnecessary for bringing nanostack toward production.\n\nAbout IBM\n\nIBM is a leading provider of global hybrid cloud and AI, and consulting\nexpertise. We help clients in more than 175 countries capitalize on insights\nfrom their data, streamline business processes, reduce costs and gain the\ncompetitive edge in their industries. Thousands of governments and corporate\nentities in critical infrastructure areas such as financial services,\ntelecommunications and healthcare rely on IBM's hybrid cloud platform and Red\nHat OpenShift to affect their digital transformations quickly, efficiently and\nsecurely. IBM's breakthrough innovations in AI, quantum computing,\nindustry-specific cloud solutions and consulting deliver open and flexible\noptions to our clients. All of this is backed by IBM's long-standing\ncommitment to trust, transparency, responsibility, inclusivity and service.\nVisit www.ibm.com (https://www.ibm.com)  for more information.\n\nMedia contact:\n\nWilla Hahn\nIBM Communications\nwilla.hahn@ibm.com (mailto:willa.hahn@ibm.com)\n\nView original content to download\nmultimedia:https://www.prnewswire.com/news-releases/ibm-and-siemens-collaborate-on-research-to-advance-nanostack-architecture-302907603.html\n(https://www.prnewswire.com/news-releases/ibm-and-siemens-collaborate-on-research-to-advance-nanostack-architecture-302907603.html)\n\nSOURCE IBM\n\n\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS654328/IBM-LOGO-1.jpg?id=OA3016979\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved.","article_body_html":"","raw_payload":{"data":{"id":"nPn4snn5Xa-20261014","title":"IBM and Siemens Collaborate on Research to Advance Nanostack Architecture","author":"PR Newswire","ticker":"IBM","created":"2026-10-14T12:00:06.082Z","tickers":["IBM"],"exchange":"NYSE","article_body":"IBM and Siemens Collaborate on Research to Advance Nanostack Architecture\nPR Newswire\n\nALBANY, N.Y., Oct. 14, 2026\n\nCollaboration aims to accelerate development of the manufacturing and design\ncapabilities needed for future nanostack generations\n\nALBANY, N.Y., Oct. 14, 2026 /PRNewswire/ -- Today, IBM (NYSE: IBM\n(https://www.ibm.com/investor/) ), in collaboration with Siemens, announced\nnew research aimed at advancing IBM's nanostack architecture\n(https://research.ibm.com/blog/what-is-a-nanostack) , a new transistor\narchitecture unveiled by IBM earlier this year. The collaboration will bring\ntogether IBM's leadership in semiconductor device innovation and Siemens'\nexpertise in electronic design automation (EDA), process simulation,\nlithography optimization, and advanced manufacturing software to accelerate\nthe development of nanostack.\n\nNanostack is the industry's first known three-dimensional, nanosheet-based\ndesign, vertically stacking and staggering transistors to pack more\ntransistors onto a chip, with nearly 100 billion transistors in a space the\nsize of a fingernail at its current 7 angstrom node. The design also unlocks\nthe use of different material combinations within each stacked layer to\noptimize performance and power efficiency of each transistor independent of\nthe other. These innovations power substantial leaps in energy efficiency,\nperformance, and SRAM scaling.\n\nEarlier this year, IBM demonstrated the viability of the nanostack\narchitecture. Now, additional advances are needed to prepare the technology\nfor manufacturing and production at scale.\n\nThrough this collaboration, IBM and Siemens will work to advance the design,\nsimulation, and lithography techniques needed for this and future nanostack\ngenerations beyond the current 7 angstrom node. The collaboration includes\ndeveloping advanced virtual models of nanostack in order to model performance,\noptimize designs, and address fabrication challenges before chips are built.\n\n\"Nanostack is a scalable transistor platform designed to shift device scaling\nfrom 2D to 3D, representing a new paradigm for the semiconductor industry and\na path forward for the logic scaling needed to support AI and other emerging\ntechnologies over the coming decade,\" said Huiming Bu, Vice President of\nSilicon Technology R&D, IBM. \"We are thrilled to work with Siemens as we\ncontinue to advance this technology and explore new approaches to extend\nangstrom-level scaling with nanostack.\"\n\n\"Scaling semiconductors into the angstrom era demands tightly coupled\nco-optimization between device physics, EDA design and manufacturing software,\nand manufacturing. As physical AI places extraordinary demands on silicon\narchitecture, IBM's 3D nanostack design represents a pivotal leap forward,\"\nsaid Ankur Gupta, Executive Vice President, EDA IC Portfolio, Siemens.\n\"Siemens' collaboration with IBM to advance virtual modeling, simulation,\nlithography, and design software optimizations needed to address physical\nlimitations early and accelerate the development of these complex\narchitectures is truly pioneering.\"\n\nBy combining IBM's semiconductor leadership with Siemens' advanced EDA\nsoftware and simulation technologies, the companies aim to accelerate\ntechnology development cycles and advance the manufacturing foundation\nnecessary for bringing nanostack toward production.\n\nAbout IBM\n\nIBM is a leading provider of global hybrid cloud and AI, and consulting\nexpertise. We help clients in more than 175 countries capitalize on insights\nfrom their data, streamline business processes, reduce costs and gain the\ncompetitive edge in their industries. Thousands of governments and corporate\nentities in critical infrastructure areas such as financial services,\ntelecommunications and healthcare rely on IBM's hybrid cloud platform and Red\nHat OpenShift to affect their digital transformations quickly, efficiently and\nsecurely. IBM's breakthrough innovations in AI, quantum computing,\nindustry-specific cloud solutions and consulting deliver open and flexible\noptions to our clients. All of this is backed by IBM's long-standing\ncommitment to trust, transparency, responsibility, inclusivity and service.\nVisit www.ibm.com (https://www.ibm.com)  for more information.\n\nMedia contact:\n\nWilla Hahn\nIBM Communications\nwilla.hahn@ibm.com (mailto:willa.hahn@ibm.com)\n\nView original content to download\nmultimedia:https://www.prnewswire.com/news-releases/ibm-and-siemens-collaborate-on-research-to-advance-nanostack-architecture-302907603.html\n(https://www.prnewswire.com/news-releases/ibm-and-siemens-collaborate-on-research-to-advance-nanostack-architecture-302907603.html)\n\nSOURCE IBM\n\n\n\nPhoto: \nhttps://mmx.prnewswire.com/media/MS654328/IBM-LOGO-1.jpg?id=OA3016979\n\nCopyright (c) 2026 PR Newswire Association,LLC. All Rights Reserved."},"type":"article","timestamp":"2026-10-14T12:00:06.150755219Z","server_sent_at_ms":1791979206150},"received_at":"2026-10-14T12:00:06.201Z","source_url":"https://www.prnewswire.com/news-releases/ibm-and-siemens-collaborate-on-research-to-advance-nanostack-architecture-302907603.html"},"analysis":null,"durationMs":null,"modelName":null}}